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  • Case Fan
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Description

FUZEIce Plus

“The Thermal Paste that your
PC has been Begging for”

Size Options

Clear

$0.00

Size (Thermal Grease )
This option is required
3.5 g 7 g
Clear selection

In order to better serve the various markets around the world, Iceberg Thermal is rebranding the name of its Thermal Paste line to FUZEIce™. This is only a name change and not a change in the products functionality or capabilities. This change in name should take effect immediately. If you have any questions or concerns, please contact us through our website.

Low Temperature with
High Thermal Conductivity

Evenly spread layers of thermal paste with a high thermal conductivity of 13 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition.

No Spatula?
No Problem!

Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind. Making it simple to apply with less mess.

Superior
Operational
Temperature

FUZEIce™ Plus can handle up to 200°C and last for years!

There’s no paste like
FUZEIce™ Plus

No Fuss, No Muss, No Problem

Specifications

Thermal Conductivity
13 W/mK
Thermal Resistance
0.04 cm2 K/W @ 60 PSI
Viscosity
60000 poise
Density
2.6 g / cm3
Volume Resistivity
1.8 x 1012
Storage Temperature
5 °C to 25 °C
Temperature
-50 °C to 200 °C
Net Weight
3.5 g / 0.13 oz
7 g / 0.25 oz

Support

Additional information

Thermal Resistance

13 W/mK

Size (Thermal Grease )

3.5 g, 7 g