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  • Case Fan
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  • Thermal Pad
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Description

FUZEIce

“The Thermal Paste that your
PC has been Begging for”

Size Options

Clear

$0.00

Size (Thermal Grease )
This option is required
3.5 g 7 g
Clear selection
In order to better serve the various markets around the world, Iceberg Thermal is rebranding the name of its Thermal Paste line to FUZEIce™. This is only a name change and not a change in the products functionality or capabilities. This change in name should take effect immediately. If you have any questions or concerns, please contact us through our website.

Low Temperature with
High Thermal Conductivity

Evenly spread layers of thermal paste with a high thermal conductivity of 11.25 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition

No Spatula?
No Problem!

Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind.
Making it simple to apply with less mess.

Superior
Operational
Temperature

FUZEIce™ can handle up to 200°C
and last for years!

There’s no paste like FUZEIce™

No Fuss, No Muss, No Problem

Specifications

Thermal Conductivity
11.25 W/mK
Thermal Resistance
0.07 cm2 K/W @ 60 PSI
Viscosity
56000 poise
Density
2.6 g / cm3
Volume Resistivity
1.8 x 1012
Storage Temperature
5 °C to 25 °C
Temperature
-50 °C to 200 °C
Net Weight
3.5 g / 0.13 oz
7 g / 0.25 oz

Support

Additional information

Thermal Resistance

11.25 W/mK

Size (Thermal Grease )

3.5 g, 7 g