Both the FIN process and the reflow soldering process are technologies designed for the heat conduction of heat pipes and radiating fins. The FIN process, as the name implies, is to insert the heat conduction heat pipe into the heat dissipation fins, without any heat conduction medium between them, and only rely on direct contact to conduct heat. The heat dissipation fins through the FIN process are not a simple plane, but are in contact with the heat pipe. In this way, the heat dissipation fins of the FIN process are stacked layer by layer, and the heat pipe can be completely wrapped, and the heat dissipation effect will not be much worse than that of the heat sink of the reflow soldering process.